Japan says progress made on $550B pact, with AI and chips weighing heavily on the next round

Japan’s trade minister said discussions on AI and semiconductors will carry very significant weight in the third tranche of its $550B US investment pact, after two rounds went to energy and minerals. The EU’s own framework contains no comparable vehicle, and commits the bloc to buying at least$40B of US AI chips. Japan’s trade […] This story continues at The Next Web