New manufacturing platforms address high-aspect-ratio etching, advanced memory deposition, metal films, and silicon-carbide epitaxy for next-generation semiconductor production. Semiconductor equipment maker AMEC (Advanced Micro-Fabrication Equipment Inc. China) introduced six new high-end semiconductor manufacturing systems covering etching, thin-film deposition and silicon-carbide epitaxy. The portfolio is aimed at demanding processes in 3D NAND, DRAM, advanced logic and […]