Vacuum technology is a foundational enabler of semiconductor manufacturing. Nearly every critical process—thin film deposition, plasma etching, ion implantation, lithography, and contamination control—depends on the ability to create and maintain controlled vacuum environments [1], [6], [7]. As device geometries shrink to the nanometer scale and wafer sizes increase to 300 mm and beyond, the precision and stability of vacuum systems become increasingly essential [2], [11]. This paper provides a
